Science, Characterization and Technology of Joining and Welding

Haghshenas, Meysam

Science, Characterization and Technology of Joining and Welding - MDPI - Multidisciplinary Digital Publishing Institute 2020 - 1 electronic resource (251 p.)

Open Access

As the Guest Editor of this Special Issue entitled ""Science, Characterization, and Technology of Joining and Welding"" of Metals, I am pleased to have this book published by MDPI. Joining, including welding, soldering, brazing, and assembly, is an essential requirement in manufacturing processes and is classified as a secondary manufacturing process. This Special Issue of Metals includes technical and review papers on, but not limited to, different aspects of joining and welding, including welding technologies (i.e., fusion-based welding and solid-state welding), characterization, metallurgy and materials science, quality control, and design and numerical simulation. This Special Issue also includes the joining of different materials, including metal and non-metals (polymers and composites), including 17 peer-reviewed papers from several researchers all around the globe (China, Germany, Brazil, South Koria, Slovakia, USA, Taiwan, Canada, and India). As of this date (April 2020), the papers in this Special Issue have been cited 47 times by other researchers, which I think is an eminent number and shows the high quality of the published papers in this Issue. This Special Issue includes a large diversity of various subjects in the field of joining: laser welding, friction stir welding, diffusion bonding, multipass welding, rotary friction-welding, friction bit joining, adhesive bonding, weldbonding, simulation and experimentation, metal/FRP joints, welding simulation, plasma-TIG coupled arc welding, liquation cracking, soldering, resin bonding, microstructural characteristics, brazing, and friction stir butt and scarf welding. I would like to sincerely thank all the researchers who contributed to this Special Issue for their high-quality research. I also would like to acknowledge Mr. Toliver Guo, Senior Assistant Editor at MDPI, who continuously and tirelessly contributed toward this Special Issue by assisting me with inviting the authors and the follow ups. I think this Special Issue will enhance our knowledge and understanding in the field of joining and assembly. I would like to dedicate this book to my wife, Mehrnoosh, for her continued support and encouragement.


Creative Commons


English

books978-3-03928-998-1 9783039289974 9783039289981

10.3390/books978-3-03928-998-1 doi

microstructure phased array ultrasonic thermophysical property FRP simulation eutectoid tint etching TAN alloy dissimilar material joining thermal compression bonding HAZ cracking welding thermal cycles IN738 superalloy carbide dissolution solder friction bit joining weld bonding interfacial microstructure adhesive thermos-mechanical property API 5L X80 steel scarf joint thermal spraying pores Cr-Mo steel welding hot pressing local brittle zone electrical properties Ti2AlNb alloy tool pin profiles adhesive bonding mechanical properties carbon fiber-reinforced polymer surface structuring m23c6 Zn-coated low carbon microalloyed steels flux-less soldering dissimilar joints energy-input medium thick plate model design of experiments oxide layer mechanical interlocking rotary friction-welding 22MnB5 ultrasonic bonding titanium anisotropy coupled arc heat-affected zone aluminum plasma-TIG joint mechanical properties hybrid joining microconstituent dual-phase steel high-crystalline content zirconia flex-on-board assembly active monomers butt joint copper clad filler foil SA213-T23 arc profile numerical simulation tailor welded blanks ceramics vacuum brazing coating longitudinal wave direct diffusion bonding metallurgy pressure distribution flow stress SnBi58 solder joint morphology adhesion dissimilar weldments laser welding distributed point heat sources model mechanical strength taguchi design bonding strength friction stir welding

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